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Pad-333066
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T/T,L/C

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SERIAL ITEM TECHNICAL DATA

1 Layers 2-30(layers)

2 Max Board Size 18" x 24"

3 Min Board Thickness 4(layers)16mil

6(layers) 32mil

8(layers) 40mil

10(layers) 48mil

4 Min Line Width 4mil

5 Min Line Space 4mil

6 Min Hole Size 8mil

7 PTH Wall Thickness 0.8mil

8 PTH dia tolerance + -2mil

9 NPTH hole dia tolerance + -1mil

10 Hole Position Deviation + -2mil

11 Outline Tolerance + - 4mil

12 S/M Pitch 3mil

13 Insulation Resistance 1E+12Ω(Normal)

14 Aspect ratio 10: 1

15 Thermal Shock 3x10Sec@288"C

16 Warp and Twist ≤0.7%

17 Electric Strength >1.3KV/mm

18 Peel Strength 1.4N/mm

19 Solder Mask Abrasion ≥6H

20 Flammability 94V-0

21 Impedance Control + - 5%